Structural monitoring: acousto-elastic stress measurement
Project duration: 01/2023 – 06/2025
This project aims to develop a pioneering online monitoring system for the continuous and cost-effective measurement of mechanical stresses and changes therein within structures. The objective is to design compact smart sensors and engineer them in such a way that they function reliably even under real-world construction site conditions. The sensors will be integrated into the structure either by force-fit or form-fit to enable precise monitoring of mechanical loads directly on or within the structure. The innovative measurement method is based on ultrasonic time-of-flight measurement within a specially developed measuring body and offers an efficient means of structural monitoring for buildings. This system will bring about a lasting improvement not only in the safety but also in the longevity of buildings and infrastructure.
Contact
Prof. Dr.-Ing. Gerold Bausch
Chair of Embedded Systems and Signal Processing
Telephone: +49 (0)341 3076 3103
Email: gerold.bausch(at)htwk-leipzig.de
Dipl.-Ing. (FH) Daniel Käßler
Research Assistant
Telephone: +49 (0)341 3076 1278
Email: daniel(dot)kaessler(at)htwk-leipzig.de
